职位描述：
具体要求： 1. Bachelor degree in engineering 2. 5 years FOL Die Bond experience 3. Be familiar with ASM and ESEC equipment and familiar with QFN is preferred 4. Good English communication and computer ability 5. Normal Shift 职责描述： 1. Machine trouble shooting and failure analysis 2. Process monitoring analysis and improvement 3. New material and process e *** and de *** 4. Generate SPEC include FMEA control plan and checklist 5. Cost and quality need to be continued improvement
单位简介
嘉盛半导体(苏州)有限公司
该公司其他招聘职位：Flipchip Technician(FC技术员)(嘉盛半导体(苏州)有限公司)Die Attach Technician（晶圆粘贴技术员）(嘉盛半导体(苏州)有限公司)Test Maintenance Technician(handler设备技术员)(嘉盛半导体(苏州)有限公司)Wire Bond Technician(金线键合技术员）(嘉盛半导体(苏州)有限公司)LGA Package Designer(嘉盛半导体(苏州)有限公司)
